Test methods

Electronic boards have to be tested after production or after individual production steps and in case of faults are found the boards have to be repaired.
Depending on the expected lot size and complexity of the PCB test methods have to be chosen according to cost-benefit equation.
Precondition for that are creativity and the knowledge of what is technically possible.
Because of that we often consult our clients during the early stages of development.

Essential objectives when testing PCBs

• Realization of a measurable production quality
• Adjusting of the quality control circle by analysing the test results and malfunction source
• Economic repair

The most used test methods are subsequently explained.
Which methods ate used depends on the product specifics, such as kompexity, lot size, expected production faults and quality requirements for the delivery.

The fault coverage of the different test methods is varying and different kinds of faults are found.

AOI -Automatic Optical Inspection
Automatic optical test of electronic boards

ICT - In-Circuit-Test
Test of components within the circuit

FKT - Funktionstest
Function of the PCBs are tested

Boundary-Scan
Test of the of the connectors of the various components